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M'munda wopanga ma semiconductor, omwe amatsata molondola kwambiri, kuchuluka kwa kukulitsa kwamafuta ndi chimodzi mwazinthu zazikulu zomwe zimakhudza kukhazikika kwazinthu komanso kukhazikika kwapangidwe. Pazochitika zonse kuchokera ku photolithography, etching to package, kusiyana kwa ma coefficients owonjezera kutentha kwa zipangizo kungasokoneze kulondola kwa kupanga m'njira zosiyanasiyana. Komabe, maziko a granite, omwe ali ndi mphamvu yowonjezera yowonjezera kutentha, yakhala chinsinsi chothetsera vutoli. ku
Ndondomeko ya Lithography: Kutentha kwa kutentha kumayambitsa kupatuka
Photolithography ndi gawo lofunikira pakupanga semiconductor. Kupyolera mu makina a photolithography, mawonekedwe ozungulira pa chigoba amasamutsidwa pamwamba pa mtanda wophimbidwa ndi photoresist. Panthawiyi, kayendetsedwe ka kutentha mkati mwa makina a photolithography ndi kukhazikika kwa worktable ndizofunika kwambiri. Tengani zida zachitsulo zachikhalidwe monga chitsanzo. Coefficient yawo yakukula kwamafuta ndi pafupifupi 12 × 10⁻⁶/℃. Pogwiritsa ntchito makina a photolithography, kutentha komwe kumapangidwa ndi kuwala kwa laser, magalasi owoneka bwino ndi zida zamakina kumapangitsa kutentha kwa zida kukwera ndi 5-10 ℃. Ngati makina ogwiritsira ntchito makina a lithography amagwiritsa ntchito zitsulo, tsinde la 1-mita lalitali lingayambitse kuwonjezereka kwa 60-120 μm, zomwe zidzatsogolera kusinthana pakati pa chigoba ndi chophwanyika. ku
M'njira zopangira zapamwamba (monga 3nm ndi 2nm), ma transistor spacing ndi ma nanometer ochepa. Kuwonongeka kwakung'ono kotereku kumakhala kokwanira kupangitsa kuti chithunzi cha photolithography chisagwirizane bwino, zomwe zimapangitsa kuti ma transistor asamayende bwino, mafupipafupi ozungulira kapena mabwalo otseguka, ndi zina, zomwe zimapangitsa kuti chip chilephereke. Kutentha kowonjezera kutentha kwa maziko a granite ndi otsika ngati 0.01μm/°C (ie, (1-2) × 10⁻⁶/℃), ndipo kupindika pansi pa kusintha kwa kutentha komweko ndi 1/10-1/5 yokha yachitsulo. Ikhoza kupereka nsanja yokhazikika yonyamula katundu pamakina a photolithography, kuonetsetsa kusamutsidwa kolondola kwa chithunzi cha photolithography ndikuwongolera kwambiri zokolola za chip kupanga. ku
Etching ndi kuyika: Zimakhudza kulondola kwa mawonekedwe
Etching ndi deposition ndi njira zazikulu zopangira zomangira zamitundu itatu pamiyala yopyapyala. Panthawi ya etching, mpweya wotulutsa mpweya umakhala ndi mankhwala opangidwa ndi zinthu zakuthupi. Pakadali pano, zinthu monga magetsi a RF ndi kuwongolera gasi mkati mwa zida zimatulutsa kutentha, zomwe zimapangitsa kuti kutentha kwa chofufumitsa ndi zida ziwonjezeke. Ngati coefficient of thermal expansion of the wafer wafer or base base sikugwirizana ndi wafer (coefficient of thermal expansion of silicon material is about 2.6×10⁻⁶/℃), kupsyinjika kwamafuta kudzapangidwa pamene kutentha kumasintha, zomwe zingayambitse ming'alu yaying'ono kapena kugwedezeka pamwamba pa nsalu yopyapyala. ku
Mapindikidwe amtunduwu adzakhudza kuya kwa etching ndi verticality ya khoma lakumbali, kuchititsa miyeso ya grooves yokhazikika, kudzera m'mabowo ndi zida zina kuti apatukane ndi zomwe zimafunikira. Mofananamo, mu ndondomeko yochepetsera filimu yopyapyala, kusiyana kwa kuwonjezereka kwa kutentha kungayambitse kupsinjika kwa mkati mu filimu yopyapyala yoyikidwa, zomwe zimayambitsa mavuto monga kusweka ndi kupukuta filimuyo, zomwe zimakhudza mphamvu ya magetsi ndi kudalirika kwa nthawi yaitali kwa chip. Kugwiritsiridwa ntchito kwa maziko a granite okhala ndi coefficient yowonjezera kutentha mofanana ndi zipangizo za silicon kumatha kuchepetsa kupsinjika kwa kutentha ndikuwonetsetsa kukhazikika ndi kulondola kwa etching ndi deposition process. ku
Poyikapo: Kusagwirizana kwa kutentha kumayambitsa zovuta zodalirika
Mu gawo lolongedza la semiconductor, kuyanjana kwa ma coefficients okulitsa kutentha pakati pa chip ndi zinthu zonyamula (monga epoxy resin, ceramics, etc.) ndikofunikira kwambiri. Kukula kwamafuta a silicon, zomwe ndi maziko a tchipisi, ndizochepa, pomwe zida zambiri zoyikapo ndizokwera kwambiri. Pamene kutentha kwa chip kumasintha pakagwiritsidwa ntchito, kupsinjika kwa kutentha kudzachitika pakati pa chip ndi zinthu zonyamula katundu chifukwa cha kusagwirizana kwa ma coefficients owonjezera kutentha. ku
Kupsinjika kwamafuta awa, chifukwa cha kusinthasintha kwa kutentha mobwerezabwereza (monga kutentha ndi kuziziritsa panthawi ya chip), kungayambitse kutopa kwa zida zogulitsira pakati pa chip ndi gawo lapansi loyikamo, kapena kupangitsa kuti mawaya omangirira pa chip agwe, pamapeto pake zomwe zimapangitsa kulephera kwa kulumikizana kwamagetsi kwa chip. Posankha zida zonyamula katundu zokhala ndi matenthedwe owonjezera omwe ali pafupi ndi zida za silicon ndikugwiritsa ntchito nsanja zoyeserera za granite zokhazikika bwino pakutentha kuti zizindikire molondola panthawi yolongedza, vuto la kusagwirizana kwamafuta litha kuchepetsedwa bwino, kudalirika kwa ma CD kumatha kupitsidwanso, ndipo moyo wautumiki wa chip ukhoza kukulitsidwa. ku
Kuwongolera chilengedwe: Kukhazikika kogwirizana kwa zida ndi nyumba zamafakitale
Kuphatikiza pa kukhudza mwachindunji kupanga, coefficient of thermal expansion ikugwirizananso ndi kuwongolera chilengedwe chonse cha mafakitale a semiconductor. M'misonkhano yayikulu yopanga ma semiconductor, zinthu monga kuyambika ndi kuyimitsidwa kwa makina oziziritsa mpweya komanso kutayika kwa kutentha kwamagulu a zida kungayambitse kusinthasintha kwa kutentha kwa chilengedwe. Ngati coefficient ya kukulitsa matenthedwe a fakitale pansi, zida zapansi ndi zina zomangamanga ndi okwera kwambiri, kwa nthawi yaitali kusintha kutentha kungachititse kuti pansi ndi kung'ambika maziko zipangizo kusintha, potero zimakhudza kulondola kwa zipangizo mwatsatanetsatane monga makina photolithography ndi etching makina. ku
Pogwiritsa ntchito maziko a granite monga zida zothandizira ndikuziphatikiza ndi zida zomangira fakitale zokhala ndi ma coefficients otsika owonjezera otentha, malo okhazikika opangira amatha kupangidwa, kuchepetsa kuchuluka kwa kuwongolera zida ndi kukonzanso ndalama zomwe zimachitika chifukwa cha kuwonongeka kwa chilengedwe, ndikuwonetsetsa kugwira ntchito kwanthawi yayitali kwa mzere wopanga semiconductor. ku
Coefficient of thermal expobility imayenda mozungulira nthawi yonse ya moyo wopanga ma semiconductor, kuyambira pakusankha zinthu, kuwongolera njira mpaka pakuyika ndi kuyesa. Zotsatira za kukula kwa kutentha kuyenera kuganiziridwa mosamalitsa mu ulalo uliwonse. Maziko a granite, okhala ndi mphamvu yotsika kwambiri ya kukulitsa matenthedwe ndi zinthu zina zabwino kwambiri, amapereka maziko okhazikika opangira ma semiconductor ndikukhala chitsimikizo chofunikira cholimbikitsira kupititsa patsogolo njira zopangira chip kuti zikhale zolondola kwambiri.
Nthawi yotumiza: May-20-2025